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Analysis of 2D via-less artificial magnetic conductors using a cavity model

Please use this identifier to cite or link to this item: http://hdl.handle.net/1959.14/104561

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Title: Analysis of 2D via-less artificial magnetic conductors using a cavity model
Related: International Symposium on Antennas and Propagation (1 - 4 November 2006 : Singapore)
Related: Proceedings of the 2006 International Symposium on Antennas and Propagation, p.1-5
Related: http://ap-s.ei.tuat.ac.jp/isapx/2006/pdf/3D2b-4.pdf
Publisher: Singapore : Research Publishing
Date: 2006
FoR/RFCD Code(s): 020500 Optical Physics 090600 Electrical and Electronic Engineering
Author/Creator: Li, Yading
Author/Creator: Esselle, Karu P
Description: A rigorous full-wave cavity model is developed for 2D vialess (i.e. uni-planar) metallic periodic structures, which may or may not have a PEC ground plane. This model considers all the homogeneous material blocks in these structures as coupled electromagnetic cavities. This coupled cavity problem is then solved using magnetic vector potential. The via-less artificial magnetic conductor (AMC) surfaces are analyzed using this cavity model and the wave reflection coefficients are calculated for normal incidence case. The results show good agreement with the full-wave HFSS simulation results. To confirm the accuracy of this method, we also compare the electric fields calculated using the cavity model and HFSS.
Description: 5 page(s)
Subject Keyword: 020500 Optical Physics
Subject Keyword: 090600 Electrical and Electronic Engineering
Resource Type: conference paper
Organisation: Macquarie University. Dept. of Electronics

Identifier: http://hdl.handle.net/1959.14/104561
Identifier: ISBN:8190317083
Identifier: mq-rm-2006005475
Language: eng
Rights: Copyright IEICE 2006. Originally published as Proceedings of the 2006 International Symposium on Antennas and Propagation, pp. 1-5 (International Symposium on Antennas and Propagation, 1 - 4 November 2006, Singapore). Version archived for private and non-commercial use with the permission of the author/s and according to publisher conditions. For further rights please contact the publisher.
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